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    资料大?。?/em> 333

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    Typically, a semiconductor pressure transducer converts applied pressure to a “low–level” voltage signal. Current technology enables this sensor output to be temperature compensated and amplified to higher voltage levels on a single silicon integrated circuit (IC). While on–chip temperature compensation and signal conditioning certainly provide a significant amount of added value to the basic sensing device, one must also consider how this final output will be used and/or interfaced for further processing. In most sensing systems, the sensor signal will be input to additional analog circuitry, control logic, or a microcontroller unit (MCU).


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